Check with seller CSP substrate Shenzhen

Published date: November 27, 2024
  • Location: Shenzhen, Shenzhen, Guangdong

CSP substrate is one of the IC bundling advancements that is utilized in the arrangement of microelectronic frameworks. The size of the bundle really depends on 1 and it very well may be a blend of parts of the number or just the initial segment. Twice the pass on size of the real bite the dust with a solitary kick the bucket bundle which has direct surface mounts capacity. It was first evolved during the 1990s because of enormous necessities for little as well as effective bundles.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WhatsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com

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